Low Odor Electronic Potting Compound
HY-9325..
HONG YE SILICONE’s Low Odor Electronic Potting Compound is an eco-friendly, safe encapsulation solution optimized for indoor and closed workshop production. As a mild fume protective encapsulation material and workplace friendly module potting compound, it features reduced volatile circuit board sealing performance. It maintains stable operation at -60℃ to 220℃, with ultra-low volatile content and zero pungent odor during mixing and curing. It integrates insulation, heat dissipation and anti-corrosion functions, ensuring both excellent electronic protection and a healthy working environment.
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Product description
HONG YE SILICONE’s Low Odor Electronic Potting Compound is an eco-friendly, safe encapsulation solution optimized for indoor and closed workshop production. As a mild fume protective encapsulation material and workplace friendly module potting compound, it features reduced volatile circuit board sealing performance. It maintains stable operation at -60℃ to 220℃, with ultra-low volatile content and zero pungent odor during mixing and curing. It integrates insulation, heat dissipation and anti-corrosion functions, ensuring both excellent electronic protection and a healthy working environment.
package4
Product Overview
Available in addition and condensation curing formulas, this low-volatile Electronic potting compound upgrades traditional potting materials’ odor defects. Serving as a safe Electronic Encapsulation Adhesive, it delivers excellent adhesion and tight sealing for PCB, PC, PMMA, CPU and multiple metal substrates. This eco Silicone Encapsulant retains professional heat dissipation performance of standard Thermally Conductive Potting Compound, balancing environmental safety and reliable circuit protection.
Technical Specifications
This workplace friendly module potting compound adopts low-odor formula technology with minimized volatile emissions and mild fume features. It boasts high structural strength, outstanding ozone and chemical erosion resistance, and can absorb thermal cycling internal stress to protect chips and bonding wires. It features stable physical and chemical properties, with customizable viscosity, hardness and operating time to fit diverse production environments.
electronic silicone
Product Features & Advantages
1. Eco-Friendly Low-Odor Performance: This mild fume protective encapsulation material produces no irritating smell during construction and curing, complying with workplace safety standards.
2. Reduced Volatile Emission: Realizes reduced volatile circuit board sealing, lowering air pollution and improving
package4
Product Overview
Available in addition and condensation curing formulas, this low-volatile Electronic potting compound upgrades traditional potting materials’ odor defects. Serving as a safe Electronic Encapsulation Adhesive, it delivers excellent adhesion and tight sealing for PCB, PC, PMMA, CPU and multiple metal substrates. This eco Silicone Encapsulant retains professional heat dissipation performance of standard Thermally Conductive Potting Compound, balancing environmental safety and reliable circuit protection.
Technical Specifications
This workplace friendly module potting compound adopts low-odor formula technology with minimized volatile emissions and mild fume features. It boasts high structural strength, outstanding ozone and chemical erosion resistance, and can absorb thermal cycling internal stress to protect chips and bonding wires. It features stable physical and chemical properties, with customizable viscosity, hardness and operating time to fit diverse production environments.
electronic silicone
Product Features & Advantages
1. Eco-Friendly Low-Odor Performance: This mild fume protective encapsulation material produces no irritating smell during construction and curing, complying with workplace safety standards.
2. Reduced Volatile Emission: Realizes reduced volatile circuit board sealing, lowering air pollution and improving