Low Viscosity Self Adhesive Silicone Gel for LED Display Potting and Waterproof Sealing
HY-9 Series (HY-9300 / HY-9400 / HY-9405)
Hong Ye Silicone HY-9 Series is a two-component platinum-cure self-adhesive silicone gel designed for LED display potting, PCB waterproof sealing and electronic module encapsulation. With ultra-low viscosity and strong self-adhesive bonding, it provides reliable protection for sensitive electronic components in demanding environments.
Quantity
Overview
The HY-9 Series electronic potting silicone gel is specifically developed for the electronics industry. It features a 1:1 mixing ratio, room temperature or heat cure capability, and bonds directly to most substrates without primer. The cured gel offers excellent electrical insulation, waterproof protection, thermal conductivity and flame retardancy, making it suitable for a wide range of electronic potting and sealing applications.
Product Usage
This product is primarily used for potting, sealing and encapsulating electronic components to provide insulation, waterproofing, dustproofing, shock absorption and thermal management. It is widely applied in LED outdoor display potting, PCB board moisture-proof sealing, power supply module encapsulation, sensor protection, cable joint sealing, transformer potting, underwater electronics protection and automotive electronic module encapsulation.
Features
Self-Adhesive Without Primer: Bonds directly to PC, PP, ABS, PVC and metal surfaces, eliminating the need for primer and reducing processing time and cost.
Ultra-Low Viscosity: Mixed viscosity as low as 600 cps flows easily into complex structures and fine gaps for complete void-free encapsulation.
Flexible Curing Options: Cures at room temperature (8h at 25°C) or with heat acceleration (20min at 80°C) to suit different production schedules.
Excellent Electrical Insulation: Dielectric strength no less than 25 kV/mm and volume resistivity no less than 1.0 x 10 to the power of 16 ohm-cm protect sensitive electronics from voltage breakdown.
Waterproof and Thermal Conductive: Forms a seamless moisture barrier while providing thermal conductivity of no less than 0.2 W/(m.K) for effective heat dissipation.
Wide Temperature and Flame Retardant: Stable performance from -50°C to 200°C with UL94 V-1 flame retardancy for safety compliance.
Ultra-Low Viscosity: Mixed viscosity as low as 600 cps flows easily into complex structures and fine gaps for complete void-free encapsulation.
Flexible Curing Options: Cures at room temperature (8h at 25°C) or with heat acceleration (20min at 80°C) to suit different production schedules.
Excellent Electrical Insulation: Dielectric strength no less than 25 kV/mm and volume resistivity no less than 1.0 x 10 to the power of 16 ohm-cm protect sensitive electronics from voltage breakdown.
Waterproof and Thermal Conductive: Forms a seamless moisture barrier while providing thermal conductivity of no less than 0.2 W/(m.K) for effective heat dissipation.
Wide Temperature and Flame Retardant: Stable performance from -50°C to 200°C with UL94 V-1 flame retardancy for safety compliance.
Usage
Step 1: Stir component A and B separately in their containers until uniform.
Step 2: Weigh A and B at 1:1 ratio by weight using a digital scale.
Step 3: Mix A and B thoroughly, then vacuum degas at -0.08 MPa for 3-5 minutes.
Step 4: Pour into the target area and cure at room temperature or heat at 80-100°C.
Application
LED outdoor display potting and waterproof protection
PCB board moisture-proof sealing
Power supply module encapsulation
Sensor and probe potting
Cable and connector sealing
Transformer and inductor potting
Underwater electronics protection
Automotive electronic module encapsulation
LED outdoor display potting and waterproof protection
PCB board moisture-proof sealing
Power supply module encapsulation
Sensor and probe potting
Cable and connector sealing
Transformer and inductor potting
Underwater electronics protection
Automotive electronic module encapsulation
Precautions
Avoid contact with organotin compounds, sulfur-containing materials and amine compounds, which may prevent curing.
Clean tools and containers thoroughly after using condensation-cure silicone before handling addition-cure products.
Do not add pigments or fillers before curing, as this may affect the catalyst system.
Store in a cool, dry place below 25°C. Keep containers tightly sealed. Shelf life is 12 months.
Avoid contact with organotin compounds, sulfur-containing materials and amine compounds, which may prevent curing.
Clean tools and containers thoroughly after using condensation-cure silicone before handling addition-cure products.
Do not add pigments or fillers before curing, as this may affect the catalyst system.
Store in a cool, dry place below 25°C. Keep containers tightly sealed. Shelf life is 12 months.
Packaging
Standard: 20kg/set (Component A 10kg + Component B 10kg)
Bulk: 200kg drum available
Custom packaging upon request
Classified as non-dangerous goods for transport
Bulk: 200kg drum available
Custom packaging upon request
Classified as non-dangerous goods for transport
FAQ
Q: What substrates does the gel bond to without primer?
A: It bonds directly to PC, PP, ABS, PVC and common metal surfaces. For other substrates, contact us for compatibility testing.
A: It bonds directly to PC, PP, ABS, PVC and common metal surfaces. For other substrates, contact us for compatibility testing.
Q: Can the product be customized?
A: Yes. Hardness, viscosity, operating time, curing speed and color can all be adjusted to meet your specific requirements.
A: Yes. Hardness, viscosity, operating time, curing speed and color can all be adjusted to meet your specific requirements.
Q: What certifications does the product have?
A: The HY-9 Series is RoHS compliant and has passed UL, MSDS, REACH and ISO9001 certifications.
A: The HY-9 Series is RoHS compliant and has passed UL, MSDS, REACH and ISO9001 certifications.