Two Component Silicone Potting Compound for Transformer and Power Supply Encapsulation
HY-E9300/HY-E9400
Hong Ye Silicone HY-9 Series is a two-component addition-cure potting compound engineered for transformer encapsulation, power supply module protection and industrial electronics sealing. Its low viscosity and self-adhesive formula ensure complete void-free filling around coil windings and complex internal structures.
Quantity
Key FeaturesAvailable Models
Model | Hardness | Viscosity (cps) | Best For
HY-9300 | 0 | 600-1000 | Transformer coil potting, transparent encapsulation where visual inspection is needed
HY-9400 | Below 0 | 680-1400 | Deep layer potting of large power modules, maximum shock absorption
HY-9405 | 5±2 | 600-1000 | General power supply potting, slightly firmer gel for structural support
Custom formulations available for hardness, viscosity, curing speed and color adjustments.
How to UseApplicationsPacking and Delivery
- Self-Adhesive Without Primer: Bonds directly to metal cores, coil windings, PCB substrates and plastic housings, eliminating primer processing steps
- Ultra-Low Viscosity: Penetrates deep into coil gaps and tight spaces around transformer windings for thorough encapsulation
- High Dielectric Strength: 25 kV/mm minimum provides reliable insulation for high-voltage transformer applications
- Thermal Management: Thermal conductivity 0.2 W/(m.K) minimum helps dissipate heat generated by power components
- 1:1 Simple Mixing: Weight-based ratio reduces measurement errors and ensures consistent curing quality
- Flexible Cure Schedule: Room temperature 8 hours or rapid heat cure 20 minutes at 80C to match production pace
- UL94 V-1 Flame Retardant: Meets international safety requirements for power and industrial electronics
- Wide Temperature Range: Performs from -50C to 200C, suitable for automotive and outdoor power equipment
Model | Hardness | Viscosity (cps) | Best For
HY-9300 | 0 | 600-1000 | Transformer coil potting, transparent encapsulation where visual inspection is needed
HY-9400 | Below 0 | 680-1400 | Deep layer potting of large power modules, maximum shock absorption
HY-9405 | 5±2 | 600-1000 | General power supply potting, slightly firmer gel for structural support
Custom formulations available for hardness, viscosity, curing speed and color adjustments.
How to Use
- Stir component A and B separately before mixing
- Weigh A and B at 1:1 by weight
- Mix thoroughly until fully homogeneous
- Vacuum degas at -0.08 MPa for 3-5 minutes
- Pour slowly into transformer or module housing
- Cure at room temperature or accelerate with heat at 80-100C
- Transformer and inductor potting and insulation
- Switching power supply module encapsulation
- Adapter and charger potting protection
- Inverter and converter sealing
- Industrial controller moisture-proof potting
- Automotive electronic control unit encapsulation
- LED driver potting and waterproof protection
- Sensor and probe potting for harsh environments
- Standard: 20kg/set (Component A 10kg + Component B 10kg)
- Sample: 1kg available for testing
- Bulk: 200kg drum available
- Non-dangerous goods for easy shipping
- Store at 25C or below, shelf life 12 months
FAQ
Q: Can this potting compound withstand high voltage?
A: Yes. The dielectric strength reaches 25 kV/mm minimum, providing reliable insulation for high-voltage transformer and power module applications.
Q: How do I handle air trapped in transformer windings?
A: After mixing, vacuum degas at -0.08 MPa for 3-5 minutes before pouring. The low viscosity helps the silicone flow into coil gaps and release trapped air naturally.
Q: What if I need faster curing for mass production?
A: Heat cure at 80-100C reduces curing time to approximately 20 minutes, ideal for high-volume production lines.
Q: Can this potting compound withstand high voltage?
A: Yes. The dielectric strength reaches 25 kV/mm minimum, providing reliable insulation for high-voltage transformer and power module applications.
Q: How do I handle air trapped in transformer windings?
A: After mixing, vacuum degas at -0.08 MPa for 3-5 minutes before pouring. The low viscosity helps the silicone flow into coil gaps and release trapped air naturally.
Q: What if I need faster curing for mass production?
A: Heat cure at 80-100C reduces curing time to approximately 20 minutes, ideal for high-volume production lines.