Hong Ye Silicone Launches HY-9 Series Electronic Potting Silicone for PCB Insulation and Waterproof Protection

The HY-9 Series uses a two-component addition-cure platinum catalyst system. Components A and B are mixed at a 1:1 weight ratio, making operation simple with no by-products during curing. The series includes three models optimized for different application needs.
HY-9300 is a zero-hardness self-adhesive transparent silicone gel with a mixed viscosity of only 600 to 1000 cps. Its outstanding flowability allows it to quickly penetrate and fill fine gaps in complex circuit structures. The self-adhesive property enables strong bonding to PC, PP, ABS, PVC and metal surfaces without primer, significantly simplifying the potting process. This model is particularly suitable for precision electronic component encapsulation where transparency is required, as well as modular power supplies and circuit boards that may need rework.

HY-9400 is an ultra-soft potting silicone gel with a hardness below zero, offering excellent shock absorption and cushioning. It is designed for deep-layer potting applications, such as overall filling protection of large electronic modules, effectively absorbing mechanical impact and vibration energy to protect fragile internal components. With a mixed viscosity of 680 to 1400 cps, it cures in 3 to 5 hours at room temperature, balancing flowability and curing efficiency.

HY-9405 is a general-purpose potting silicone gel with a hardness of 5 plus or minus 2 Shore A, providing better structural support than the other two models. Its operating time of 1 to 3 hours suits production scenarios that require a wider working window. This model is widely used for PCB sealing, power module encapsulation and sensor potting applications.

All three models deliver excellent electrical insulation, with a dielectric strength of no less than 25 kV/mm and volume resistivity of no less than 1.0 x 10 to the power of 16 ohm-cm after curing, creating a reliable insulation barrier for sensitive electronics. The thermal conductivity of no less than 0.2 W/(m.K) helps dissipate heat generated during component operation and maintain safe working temperatures.

Waterproof and moisture-proof performance is another core advantage. The cured gel forms a dense, seamless sealing layer that effectively blocks water and humidity. Combined with a working temperature range of -50°C to 200°C and UL94 V-1 flame retardancy, the HY-9 Series is capable of handling demanding environments including outdoor LED displays, marine electronics and automotive engine compartment modules.

Custom formulation services are also available. Hardness, viscosity, operating time, curing speed and color can all be adjusted to meet specific application requirements. The HY-9 Series has passed RoHS, UL, MSDS and REACH certifications, with strict quality control maintained under the ISO9001 management system. Products are exported to over 138 countries worldwide.

The launch of the HY-9 Series further strengthens the product portfolio in the electronic potting field, providing the electronics industry with a more professional and efficient potting protection solution.